Input devices (including tablets) is one of the 3 current overarching Goals of the KDE project, so now might be a good time to get involved with testing.
https://community.kde.org/Goals/Input
https://kde.org/goals/

If you’re on KDE there is kdotool , kdotool - a xdotool clone for KDE Wayland that works in conjunction with ydotool

The main one is KiCAD (electronics design).

They have a good article on the challenges they’re facing on Wayland, worth a read https://www.kicad.org/blog/2025/06/KiCad-and-Wayland-Support/

Yes now you can. But not initially. The old cube effect was removed and later re-implement

Thanks for sharing! TIL about autofs. Now I’m curious to try NFS again.

What’s the failure mode if the NFS happens to be offline when PBS initiates a backup? Does PNS try to backup anyway? What if the NFS is offline while PBS boots?

EDIT: What was the reason for bind mounting the NFS share via the host to the container, and NFS mounting from NAS to host?
I did the NFS-mount directly in the PBS. (But I am running my PBS as a VM, so had to do it that way)

I run PBS as a virtual machine on Proxmox, with a dedicated physical harddrive passed through to PBS for the data.

While this protects from software failures of my VMs, it does not protect from catastrophic hardware failure. In theory I should be able to take the dedicated harddrive out and put it in any other system running a fresh PBS, but I have not tested this.

I tried running the same PBS with an external NFS share, but had speed and stability issue, mainly due to the hardware of the NFS host. And I wasn’t aware of autofs at the time, so the NFS share stayed disconnected

In Danish and Norwegian the equivalent idiom is to “Swallow a camel” which sounds much funnier xD

Divide Germany you say? I feel like that’s been done before

“Package” as in taking the raw chip and making it a finalised electronics component, as suggested here?

https://lemmy.world/comment/20348183

Wow that makes so much sense!

When reading “packaging” in the news articles it sounds like some relatively simple logistics operating.

But for electronics and semi-conductors, the “packaging” is very much part of the manufacturing process to get a usable product. Like chips that come in Surface Mount and Through Hole versions

This happened a while ago, article is from 22nd july